The following study was conducted by Scientists from Weldon School of Biomedical Engineering, Purdue University, West Lafayette, USA; Department of Bioengineering, Rice University, Houston, USA; Department of Electrical and Computer Engineering, Rice University, Houston, USA; Department of Bioengineering, Rice University, Houston, USA; Department of Electrical and Computer Engineering, Rice University, Houston, USA; Applied Physics Program, Rice University, Houston, USA; Department of Neuroscience, Baylor College of Medicine, One Baylor Plaza, Houston, USA. Study is published in iScience – Cell Press Journal Publication as detailed below.
Bioelectronics for Millimeter-Sized Model Organisms
Abstract
Advances in microfabrication technologies and biomaterials have enabled a growing class of electronic devices that can stimulate and record bioelectronic signals. Many of these devices have been developed for humans or vertebrate animals, where miniaturization allows for implantation within the body. There are, however, another class of bioelectronic interfaces that exploit microfabrication and nanoelectronics to record signals from tiny, millimeter-sized organisms. In these cases, rather than implanting a device inside an animal, animals themselves are loaded in large numbers into bioelectronic devices for neural circuit and behavioral interrogation. These scalable interfaces provide platforms to develop new therapeutics as well as better understand basic principles of bioelectronic communication, neuroscience, and behavior. Here we review recent progress in these bioelectronic technologies and describe how they can complement on-chip optical, mechanical, and chemical interrogation methods to achieve high-throughput, multimodal studies of millimeter-sized small animals.
Source:
iScience – Cell Press Journal Publication
URL: https://www.cell.com/iscience/fulltext/S2589-0042(20)30101-2#secsectitle0040
Citation:
Gonzales, D. L., K. N. Badhiwala, et al. (2020). “Bioelectronics for Millimeter-Sized Model Organisms.” iScience 23(3), 100917.
